The sensors are adapted for use for touchless and non-contact detection of objects, shapes and persons.
Hamamatsu recently started offering three newly developed distance sensors. At the same time, an expansion of
the portfolio via a modular solution is planned. The integrated ASIC simplifies signal control and evaluation of
the corresponding laser diode and detector for the user.
Main features of the new sensors
- Three different pixel configurations:
64 Pixel, 256 Pixel and 96 × 72 Pixel
- High sensitivity in the near-infrared region
- Improved tolerance to background light
- Compact wafer level package (WLP) type
Function of a 3D ToF sensor
3D ToF sensors consist of an optical sensor element (linear or area array), shift register, output buffer
amplifier, bias voltage generator, clock generator and other components. The sensors are used in combination
with a modulated light source (LED or laser diode). They collect information about phase differences and transit
time of the transmitted and received light pulses. The distance data are determined by external signal
processing or computer-aided measurement technology.
New products under development
Hamamatsu plans to introduce a new distance sensor module with an integrated back-thinned 3D ToF sensor.
Customized products are also possible. This enables the manufacturer to meet a wide range of requirements – from
changes to the specifications of standard products to completely new designs.
In addition to its own optical transmitter and receiver components, Hamamatsu also has various technologies at
its disposal – for example optical design, circuit design, assembly. By combining these technologies, Hamamatsu
can offer modules with even higher performance.
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