The Answer to Heat Challenges

High-Temperature Resistant Flexible Printed Circuit Board YFLEX

The YFLEX flexible printed circuit board from Yamaichi Electronics is now also available as a high-heat resistant version for extreme environments. This innovative FPC was developed to meet the requirements in areas such as automotive, semiconductor manufacturing and test and measurement technology.
Connector Technology
Structure of a YFLEX for fast data transmission up to 112 Gbps

Improved insulating layer for extreme conditions

Improved insulating layer for extreme conditions

The high-temperature resistant Flexible Printed Circuit YFLEX impresses with its improved insulating layer, which has increased adhesion thanks to the use of a special cover layer. Even under extreme temperatures of up to 150 °C, it retains its electrical properties for over 3,000 hours.
The continuity resistance remains within a rate of change of ±10 percent and the insulation resistance is 500 MΩ or higher. This outstanding resistance ensures the reliable performance of the FPC even in the most adverse environments.

Flexibility for a wide range of applications

The printed circuit board is extremely versatile and can be produced in both single-layer and double-layer configurations. The insulation substrate base can be selected from liquid crystal polymer (LCP) or polyimide (PI) in order to optimally adapt to different applications.
In addition, it has a reinforced GND design that is suitable not only for high-heat-resistant but also for noise-resistant FPC applications.

About the High-Speed FPC YFLEX and other Types

YFLEX is a special High Speed FPC (Flexible Printed Circuit) which is able to transmit up to 112 Gbps with differential Impedance of 100 Ohm.
This high performance is given by different features, like LCP as base material, the contacting of different layers done by silver bumps and the special production process.
This makes the YFLEX to the best partner for our High-Speed Connector series like HF513, HF509, HF601 and HF507. Each YFLEX will be designed based on the customer’s specific requirements, so that all parameters like pinning, number of layers and routing can be done individually.

Whitepaper YFLEX

The Whitepaper „YFLEX – The Future of Fast Data Transmission“ features more information on the innovative yet established approach of YFLEX technology compared to FFC, FPC and micro-coaxial cables as well as the application areas of YFLEX as used by EMC measurement technology market leader Rohde & Schwarz.
 Whitepaper YFLEX


  • Available to transmit high-speed in Gbps with low loss
  • Effective to use at harshest temperature, humidity and EMI condition
  • Customised depending on the layout and requirement
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